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| BAV170... Silicon Low Leakage Diode Array * Low-leakage applications * Medium speed switching times * Pb-free (RoHS compliant) package 1) * Qualified according AEC Q101 BAV170 ! , , Type BAV170 Parameter Diode reverse voltage Peak reverse voltage Forward current Package SOT23 Configuration common cathode Symbol VR VRM IF IFSM 4.5 0.5 Ptot Tj Tstg 250 150 -65 ... 150 Value 80 85 200 Marking JXs Unit V mA A Maximum Ratings at TA = 25C, unless otherwise specified Non-repetitive peak surge forward current t = 1 s t=1s Total power dissipation TS 35C Junction temperature Storage temperature mW C Thermal Resistance Parameter Junction - soldering point 2) BAV170 1Pb-containing 2For Symbol RthJS Value 460 Unit K/W package may be available upon special request calculation of RthJA please refer to Application Note Thermal Resistance 1 2007-04-19 BAV170... Electrical Characteristics at TA = 25C, unless otherwise specified Symbol Values Unit Parameter min. typ. max. DC Characteristics 85 V Breakdown voltage V(BR) I(BR) = 100 A Reverse current VR = 75 V VR = 75 V, TA = 150 C Forward voltage IF = 1 mA IF = 10 mA IF = 50 mA IF = 150 mA AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz Reverse recovery time IF = 10 mA, IR = 10 mA, measured at IR = 1mA, RL = 100 Test circuit for reverse recovery time D.U.T. IR VF 900 1000 1100 1250 5 80 nA mV CT trr - 2 0.6 1.5 pF s Pulse generator: tp = 10s, D = 0.05, tr = 0.6ns, Ri = 50 Oscillograph F Oscillograph: R = 50, tr = 0.35ns, C 1pF EHN00019 2 2007-04-19 BAV170... Reverse current IR = (TA) VR = 70V 10 2 BAV 170 EHB00080 Forward Voltage VF = (TA) IF = Parameter 1.5 V max BAV 170 EHB00083 R nA 10 1 VF 1.0 10 0 typ 10 -1 0.5 10-2 F = 150 mA 50 mA 10 mA 1 mA 0.1 mA 10-3 0 50 100 TA C 150 0 0 50 100 TA C 150 Forward current IF = (VF) TA = 25C 150 BAV 170 EHB00081 Forward current IF = (T S) BAV170 250 mA F mA 200 175 100 IF 150 125 100 typ max 50 75 50 25 0 0 0.5 1.0 V VF 1.5 0 0 15 30 45 60 75 90 105 120 C 150 TS 3 2007-04-19 BAV170... Permissible Puls Load RthJS = (tp) Permissible Pulse Load IFmax / I FDC = (t p) 10 3 10 2 10 2 10 1 I Fmax/IFDC - 10 1 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 RthJS 10 0 D = 0,5 0,2 0,1 0,05 0,02 0,01 0,005 0 10 -1 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 10 0 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 TP TP 4 2007-04-19 Package SOT23 BAV170... Package Outline 0.15 MIN. 1 0.1 0.1 MAX. 1.3 0.1 2.9 0.1 3 B 2.4 0.15 10 MAX. 0.4 +0.1 -0.05 1) 1 2 10 MAX. C 0.95 1.9 0.08...0.1 A 5 0...8 0.25 M B C 0.2 M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s Pin 1 0.9 1.3 2005, June Date code (YM) BCW66 Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 4 0.9 2.13 2.65 0.2 8 Pin 1 3.15 1.15 5 2007-04-19 BAV170... Edition 2006-02-01 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2007-04-19 |
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